This project investigated end-to-end thermal management solutions for the use of commercial off the shelf (COTS) components and assemblies on aircraft platforms. It addressed the thermal management system from the component junction to the aircraft thermal sink. The research investigated the impact on electronics systems architectures, aircraft system performance requirements, start-up time lines, operating scenarios and maintenance practices necessary to accommodate COTS based electronics systems considering the lower operating temperature limits of COTS components.
The research effort of the project was comprised of the following tasks.
Identify representative aircraft platforms for further study.
Identify representative LRU’s and functions for further study.
Identify thermal density requirements and component assembly temperature limits.
Identify candidate LRU packaging/cooling methods.
Define aircraft system cooling capability and ambient environments.
Define impact of operating scenarios, start-up timelines and maintenance practices.
Evaluate existing practice.
Review related industry and university efforts.
